Thin Film Stress Measurement Device "FLX Series"
Thin film stress measurement device widely used for research purposes in universities and laboratories.
The "FLX Series" is a device that can measure thin film stress non-contact and non-destructively with high density and stability using laser beams. It automatically selects between two types of lasers with different wavelengths, accommodating various substrates and film types. In addition to the semiconductor industry and semiconductor/material manufacturers, it has recently been used extensively as a monitoring device in applications such as LEDs, solar cells, MEMS, power devices, and FPDs. 【Features】 ■ Simple and highly functional ■ Low cost, space-saving ■ Measurement settings (scan points, low reflection alarm, elastic modulus, substrate thickness, substrate size, stress units, substrate type, laser selection) *For more details, please download the PDF or feel free to contact us.
- Company：東朋テクノロジー
- Price：Other
